The speed of development of electronic products is far more than we currently see, especially when the design of electronic products is inseparable from the outer packaging of plastic boxes. The slogan of the Internet's overnight hot scenes "mainly temperament." I must also know that everyone knows that hype and buzzwords are the reason, so it's best to do their own products well. With the development of global economic integration, the pace of life has been significantly accelerated, and the psychology of novelty and product differentiation has become more intense and widespread.

Blister application

1. Pallet: It is often used for the turnover and transportation of products. It is suitable for mechanization and automatic packaging, convenient for modern management, saving manpower and improving efficiency.

2. Blister box: can be directly used for the outer packaging of the product to enhance the sales competitiveness of the product. Common packaging methods include: card blister, heat blister, high frequency blister, folded blister, three fold blister and so on.

It is produced by fully automatic high-speed plastic blister forming machine. The basic principle is: the rolled sheet is pulled into the furnace oven and heated to the softened state. Then it is heated and then pulled to the top of the blister mold. The mold is moved up and evacuated, which will soften the The sheet is adsorbed on the surface of the mold, and the cooling water is sprayed on the surface of the formed sheet in a mist to harden it, the formed sheet is automatically pulled to the storage box, and the pneumatic knife separates the formed sheet and the unformed sheet. In order to complete the entire process. Most of the major quality problems of plastic products occur in this process: 1. Blister is not in place, refers to the shape deformation, there is no blister into the same shape of the product with the mold; 2. Overmolded, refers to the product is too thin; 3 Pulling wire refers to the appearance of undesired line marks on the molded product; 4. Uneven thickness. All of these problems need to be debugged in place after a good mold, including: sheet advancement time, heating temperature and time, vacuum pumping strength and time, position, time and depth of the drop of the upper mold, placement of the mold in the imposition. Location, whether to add accessories and other molds.